1. Introduction 2. Substrate-induced strain engineering in CMOS technology 3. Process-induced stress engineering in CMOS technology 4. Electronic properties of strain-engineered semiconductors 5. Strain-engineered MOSFETs 6. Noise in strain-engineered devices / C. Mukherjee 7. Technology CAD of strain-engineered MOSFETs 8. Reliability and degradation of strain-engineered MOSFETs 9. Process compact modelling of strain-engineered MOSFETs 10. Process-aware design of strain-engineered MOSFETs 11. Conclusions.
"This book brings together new developments in the area of spin-engineered MOSFETs using high-mobility substrates such as SIGe, strained-Si, germanium-on-insulator, and III-V semiconductors. The authors cover the materials aspects, principles, design, fabrication, and applications of advanced devices. They present a full TCAD methodology for strain-engineering in Si CMOS technology involving data flow from process simulation to systematic process variability simulation and generation of SPICE process compact models for manufacturing for yield optimization"--
9781315216577
10.1201/9781315216577 doi
Integrated circuits--Fault tolerance. Metal oxide semiconductor field-effect transistors--Reliability. Strains and stresses.